High-performance semiconductor module



FIG. 1 is a top, front and right side perspective view of a high-performance semiconductor module showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front side elevational view thereof;

FIG. 4 is a right side elevational view thereof; and,

FIG. 5 is a top plan view thereof.

The broken line portions of the figure drawings are included to show portions of the article that form no part of the claimed design.

All surfaces not shown form no part of the claimed design. 

CLAIM The ornamental design for a high-performance semiconductor module, as shown and described. 